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300TG4GF Super Green
(60 Degree) LED Lamp
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Solder Dipping |
Soldering |
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(1) Pre-Heat: 1000C
Max. |
(1) 30W Max. Soldering Iron |
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(2) Pre-Heat Time: 60 seconds |
(2) Soldering Temperature: 3000C
Max. |
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(3) Solder Temperature: 2600C
Max |
(3) Soldering Time: 3 seconds Max. |
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(4) Dipping Time: 5 Sec. Max. & No closer than 3mm from
bulb |
(4) No closer than 3mm from base
of bulb |
Absolute Maximum Rating (Ta = 250C)
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PARAMETER |
MAXIMUM RATING |
UNITS |
|
DC Forward Current |
30 |
mA |
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Reverse Voltage (IR = 10mA) |
5 |
V |
|
Peak Pulse Forward Current (1) |
100 |
mA |
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Avg. Forward Current (Pulse Operation) |
30 |
mA |
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Operating Temperature |
-30 to
+80 |
0C |
|
Storage Temperature |
-40 to
+100 |
0C |
(1) Pulse conditions of 1/10 duty and 0.1msec
width
Electro-optical Characteristics (Ta
= 250C)
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PARAMETER |
SYMBOL |
CONDITIONS |
MIN. |
TYP. |
MAX. |
UNIT |
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Forward Voltage |
VF |
IF = 20mA |
|
3.3 |
4.0 |
V |
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Reverse Voltage |
VR |
IR = 10mA |
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|
5 |
V |
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Dominant Wavelength |
lD |
IF = 20mA |
515 |
|
530 |
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Viewing Angle |
2q1/2 |
IF = 20mA |
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60 |
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Deg. |
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Luminous Intensity |
IV |
IF = 20mA |
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2,800 |
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mcd |
INTENSITY BIN lv (mcd)
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Bin |
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1 |
1,650 |
1,850 |
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1 = 2.8V-3.0V |
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2 |
1,850 |
2,500 |
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2 = 3.0V-3.2V |
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3 |
2,500 |
3,100 |
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3 = 3.2V-3.4V |
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4 |
3,100 |
3,500 |
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4 = 3.4V-3.6V |
COLOR BIN CB (x,y)
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W1 |
503 nm –
508 nm |
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W2 |
508 nm –
515 nm |
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W3 |
515 nm –
525 nm |
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W4 |
525 nm –
532 nm |
DEVICE DIAGRAM
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LC LED Corporation |