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300JPT4GF Super Amber
(60 Degree) LED Lamp
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Solder Dipping |
Soldering |
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(1) Pre-Heat: 1000C
Max. |
(1) 30W Max. Soldering Iron |
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(2) Pre-Heat Time: 60 seconds |
(2) Soldering Temperature: 3000C
Max. |
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(3) Solder Temperature: 2600C
Max |
(3) Soldering Time: 3 seconds Max. |
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(4) Dipping Time: 5 Sec. Max. & No closer than 3mm from
bulb |
(4) No closer than 3mm from base
of bulb |
Absolute Maximum Rating (Ta = 250C)
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PARAMETER |
MAXIMUM RATING |
UNITS |
|
DC Forward Current |
30 |
mA |
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Reverse Voltage (IR = 10mA) |
5 |
V |
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Peak Pulse Forward Current (1) |
100 |
mA |
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Avg. Forward Current (Pulse Operation) |
30 |
mA |
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Operating Temperature |
-30 to +80 |
0C |
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Storage Temperature |
-40 to +100 |
0C |
(1) Pulse conditions of 1/10 duty and 0.1msec
width
Electro-optical Characteristics (Ta
= 250C)
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PARAMETER |
SYMBOL |
CONDITIONS |
MIN. |
TYP. |
MAX. |
UNIT |
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Forward Voltage |
VF |
IF = 20mA |
|
1.7 |
2.1 |
V |
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Reverse Voltage |
VR |
IR = 10mA |
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|
5 |
V |
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Dominant Wavelength |
lD |
IF = 20mA |
|
590 |
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Viewing Angle |
2q1/2 |
IF = 20mA |
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60 |
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Deg. |
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Luminous Intensity |
IV |
IF = 20mA |
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2,500 |
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mcd |
INTENSITY BIN lv (mcd)
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Bin |
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1 |
1,500 |
1,950 |
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1 = 1.7V-1.9V |
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2 |
1,950 |
2,250 |
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2 = 1.9V-2.1V |
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3 |
2,250 |
2,750 |
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3 = 2.1V-2.3V |
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4 |
2,750 |
3,150 |
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4 = 2.2V-2.5V |
COLOR BIN CB (x,y)
|
W1 |
588 nm –
590nm |
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W2 |
590 nm –
592 nm |
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W3 |
592 nm –
595 nm |
DEVICE DRAWING
| LC LED Corporation |